High Thermal Conductivity Gap Filler Pads

Thermal Conductive Pad/Gap Filler - DTCP -015

DTCP – 015 – Thermal Conductive Pad / Gap Filler is our most flexible & diverse line of Thermal conductive. The compressibility & adhesion features enable a dramatic reduction in thermal resistance when mounting. Its flexibility & elasticity suits uneven surface, parts with varying heights & devises that require greater flexibility in design, all the while reducing overall stress to the PCB & eliminating tolerances.

Features:

• High Thermal conductivity.

• Reduces Thermal Resistance

• Wide Range of Hardness.

• Flexible, easy Contouring

• Single & Double Sided Adhesive

• Puncture, Shear & Rear Resistant.

Applications:

• EV Battery,

• Heat sink, Memory modules

• LED Lighting, LCD-TV

• Military Electronics

• Power Supplies

• Telecom services,

• Wireless instruments

• Automotive control services